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WIRE ATTACHMENTS WITH SECURITY BALL BONDS

IP.com Disclosure Number: IPCOM000213664D
Publication Date: 2011-Dec-30

Publishing Venue

The IP.com Prior Art Database

Abstract

A wire attachment includes a wire bond between a biocompatible conductor and a contact pad. A security ball bond consisting essentially of platinum is formed over the wire bond and bonds to both the biocompatible conductor and areas of the contact pad adjacent to the biocompatible conductor. A method for forming a wire bond is also presented.

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BACKGROUND

    [0001] Wire bonding techniques are used to create wire attachments between a wire and a contact pad. The wire attachment mechanically secures the wire to the contact pad and allows electrical signals to be passed between the wire and the contact pad.

BRIEF DESCRIPTION OF THE DRAWINGS

    [0002] The accompanying drawings illustrate various embodiments of the principles described herein and are a part of the specification. The illustrated embodiments are merely examples and do not limit the scope of the claims.

    [0003] Fig. 1A is a microphotograph of an illustrative wire attachment formed using a tape automated bond (TAB) technique, according to one embodiment of principles described herein.

    [0004] Fig. 1B is a cross-sectional diagram of the illustrative wire attachment formed using a TAB technique, according to one embodiment of principles described herein.

    [0005] Fig. 2A is a microphotograph of an illustrative embodiment of a wire attachment with security ball bonds formed over a TAB bond, according to one embodiment of principles described herein.

    [0006] Fig. 2B shows illustrative steps in forming a ball bond over a wire which is TAB bonded to a contact pad, according to one embodiment of principles described herein.

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WIRE ATTACHMENTS WITH SECURITY BALL BONDS



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    [0007] Fig. 2C is a perspective view of an illustrative wire attachment with security ball bonds formed over a TAB bond, according to one embodiment of principles described herein.

    [0008] Fig. 2D is a cross-sectional view of an illustrative wire attachment with security ball bonds formed on a thin film pad, according to one embodiment of principles described herein.

    [0009] Fig. 2E is a cross-sectional view of an illustrative stitch bond wire attachment, according to one embodiment of principles described herein.

    [0010] Fig. 3A is a perspective view of an illustrative wire attachment which uses security ball bonds to secure a wire ribbon to a contact pad, according to one embodiment of principles described herein.

    [0011] Fig. 3B is a perspective view of an illustrative wire attachment which uses security ball bonds to secure a wire ribbon to a contact pad, according to one embodiment of principles described herein.

    [0012] Fig. 4 is a flowchart of an illustrative method for forming a wire attachment with security ball bonds, according to one embodiment of principles described herein.

    [0013] Fig. 5 is a flowchart of an illustrative method for forming a stitch bond wire attachment, according to one embodiment of principles described herein.

    [0014] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements.

DETAILED DESCRIPTION

    [0015] To create interfaces with electronic devices, there is often a need to make wire connections to contact pads or other conductive surfaces. For example, wire connections are typically used to make interconnections between integrated circuits, or betwee...