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WIRE ATTACHMENTS WITH SECURITY BALL BONDS

IP.com Disclosure Number: IPCOM000213664D
Publication Date: 2011-Dec-30

Publishing Venue

The IP.com Prior Art Database

Abstract

A wire attachment includes a wire bond between a biocompatible conductor and a contact pad. A security ball bond consisting essentially of platinum is formed over the wire bond and bonds to both the biocompatible conductor and areas of the contact pad adjacent to the biocompatible conductor. A method for forming a wire bond is also presented.