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High Temperature Ultrasonic Microscopy Method

IP.com Disclosure Number: IPCOM000231119D
Publication Date: 2013-Sep-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to perform high temperature ultrasonic microscopy without causing damage to organic electronics packages. The method involves heating the electronic components to the associated operating temperature(s) and submerging the part in a hot bath of low acoustic impedance fluid to maintain that temperature.