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Method for Placing Capacitance Proximity Sensor on a TSV Backside Grind

IP.com Disclosure Number: IPCOM000234583D
Publication Date: 2014-Jan-20

Publishing Venue

The IP.com Prior Art Database

Abstract

A method is disclosed for placing a sensor based on capacitance on a rotating grind wheel via shock absorbing attachment pads. The sensor assists in determining approach of TSV during backside grinding in a wafer finish.