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Ultra thin housing solution for OLEDs Disclosure Number: IPCOM000234670D
Publication Date: 2014-Jan-28
Document File: 9 page(s) / 66K

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The Prior Art Database



This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 24% of the total text.

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Ultra-thin OLED Module

The invention relates generally to an OLED Module.


   Nowadays, an important requirement on the OLED module is the total thickness of the module. For cosmetic reasons the thickness needs to be reduced to a minimum. Another important requirement is the width of the mechanics around the lighting area of the OLED. This parameter needs also be reduced to a minimum.

   Reducing module thickness and rim thickness around the lighting area of the OLED has a negative influence on the mechanical stiffness of the OLED module. Also the resistance against torsion and the protection against side impact are really decreased, when reducing both housing parameters.

   In particular the OLED substrate and the Thin Film Encapsulation layer (TFE - layer) are the most sensitive parts of the OLED module. The OLED substrate is constructed of a 0.7 mm thick glass substrate and the TFE layer is built up several SiN; a getter and a plastic layer with a total thickness of 80 ┬ÁM. Damaging of the OLED substrate or TFE layer has an immediate effect on the lighting performance of the OLED. Therefore the most important function of the housing is mechanical protection of the sensitive OLED.


   It is an object of the invention, among others, to achieve an ultra-thin OLED module with high resistance against torsion.

   According an embodiment of the invention, an OLED module, comprises a housing including a plastic front frame and a metal back cover; wherein the front frame has a light exit window, and an OLED panel enclosed in the housing; wherein the panel has a light emitting surface and - 1 -







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a back surface; the light emitting surface faces the light exit window, the back surface thermally engages with the back cover via a heat pad; and a driving circuit for the OLED panel is mounted on the back surface; wherein the front frame and the back cover are adhered to each other with double side adhesive tapes.

   Further, in the OLED module the front frame is provided with discrete protrusions on edges for engaging with the back cover.

   Further, in the OLED module the front frame comprises a recess to accommodate the OLED panel, and wherein the recess is wider in dimension than the OLED panel to allow thermal expansion of the OLED panel.

   It is noted that the invention relates to all possible combinations of features recited in the claims.


   These and other aspects of the OLED module according to the invention will become apparent from and will be elucidated with respect to the implementations and embodiments described hereinafter and with reference to the accompanying drawings. In the drawings:

Figure 1 shows a partial sectional view of an example of an OLED module according to the present invention;

Figure 2 is a back view of the original housing design in prior art; Figure 3 is a back view of the new housing design accordin...