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Method of Flexible Bonding Between Dies and Package Pins

IP.com Disclosure Number: IPCOM000236443D
Publication Date: 2014-Apr-25

Publishing Venue

The IP.com Prior Art Database

Abstract

A multi-layer lead frame is formed by laminating an insulating layer of non conductive material on a lead frame body and then laminating an electrically conductive layer on top of the non-conductive later. The top, conductive layer can be used to provide additional pin output without tooling new lead frames, provide flexibility in pin locations, and provide flexibility in the design and pin shaped, which are limited by lead frames