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Multiple Pre-Tacking of Anisotropic Conductive Film (ACF) Disclosure Number: IPCOM000237158D
Publication Date: 2014-Jun-05
Document File: 4 page(s) / 125K

Publishing Venue

The Prior Art Database


Two new methods of pre-tacking anisotropic conductive film (ACF) to a substrate are proposed to improve productivity and eliminate out-gassing in interconnect bonding applications. Both methods include simultaneously pre-tacking multiple ACF cut-outs using a multiple head heat bonding apparatus. The first method includes using a single die, cutting blade to cut ACF cut-outs individually, followed by pre-tacking all cut-outs simultaneously. The second method includes the use of a multiple die, cutting blade to cut all ACF cut-outs simultaneously, followed by pre-tacking all cut-outs simultaneously.

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    Anisotropic conductive film is used to provide electrical interconnection between flexible circuit from a slider head and a printed circuit cable assembly (PCCA), in hard disk drive (HDD) applications. There are two process steps to apply the ACF to the substrate, pre- tacking and final bonding. This paper will describe a new method for the pre-tacking step.

    Pre-tacking starts with unwinding the ACF from its roll (the roll includes the ACF and an associated liner). The ACF is then cut to the required size. Next, the ACF is pre-tacked to a substrate, using the recommend heat and pressure conditions, by a heat bonding head. After pre-tacking, the ACF liner is removed. A typical ACF pre-tacking method is show in Figure
1. Currently, the pre-tacking method includes individual cutting of a single ACF cut-out followed by bonding the cut-out to its specific location. The individual cutting and tacking process continues until all the connection locations are covered with ACF.

Figure 1. Typical ACF Pre-Tacking

    Current trends in HDD design include multiple electrical interconnection of the head gimbal assembly (HGA) flexible circuit and actuator arm flexible circuit. Additionally,

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productivity improvement is a key manufacturing performance parameter. Current pre- tacking cycle times may need to be improved to improve productivity. The new method of ACF pre-tacking will address this productivity improvement need.

New ACF Pre-tacking Method:

    The new (ACF) pre-tacking method will help to improve productivity in ACF interconnect applications. The method of multiple pre-tacking includes a multiple pre-tacking step, i.e. ACF is pre-tacked in multiple locations, simultaneously, through the use of a multiple head heat bonding apparatus. The multiple pre-tacking method can reduce pre- tacking cycle time in each bonding area. This approach can reduce process cycle time and pre-tackin...