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Vias in ceramic substrates Disclosure Number: IPCOM000237248D
Publication Date: 2014-Jun-10
Document File: 1 page(s) / 301K

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Vias in ceramic substrates

The invention proposes to realize an electrical via in ceramic Direct Copper Bond (DCB)-Substrates by using pre-structured top-copper, a ceramic layer with cutouts, e.g. holes, a massive bottom-copper, etching the copper layers, and electrically connecting the top-copper and bottom-copper by wire-bonding. Bonding is preferably carried out in the same step the die on top of the substrate is wire-bonded and before separating the single devices from the DCB-board. In Fig 2 the manufacturing flow according to the invention is shown.

The advantage is that standard bonding technology can be used to create vias. The known vias in DCB-substrates are non-standard processes and therefore not suitable for high volumes at affordable prices.










DCB-Stack for bonded vias

Section of bonded DCB

Top-/bottomview of etched DCB

Bonded vias

Figure 2: Manufacturing-Flow for DCB and bonded vias


For electro-optical devices in many cases a substrate with high thermal conductivity and no electrical conductivity is needed. Compared to PCBs and MCPCBs the design-options are very limited, especially for non-high-end applications where costs do matter.

One design-option needed e.g. for SMT-attached high-power electro-optical devices is an electrical via (Figure 1). Such vias in ceramic substrates are non-standard processes and therefore not suitable for high volumes at affordable prices.



Plugged via in ceram...