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A Method to Enable Multiple Substrate Thicknesses within a Single Parasitic Technology File Disclosure Number: IPCOM000237496D
Publication Date: 2014-Jun-19
Document File: 3 page(s) / 183K

Publishing Venue

The Prior Art Database


Conventionally, VLSI (Very Large Scale Integration) technologies have single substrate/wafer thickness. However, with the advent of 3D technologies and TSV (Through Silicon VIA) enablement, same technology can now have multiple substrate/wafer thicknesses. This calls for parallel enhancement in the parasitic technology file development and analysis to support these new requirements. As per our existing methodology, we need to develop separate parasitic technology file for each substrate thickness offered in the technology. However, this approach increases the development and validation cycle time. Also, it is more susceptible to quality issues and user error. Moreover, from the customer view point, the existing approach requires more effort to maintain and is not user friendly. We propose a method to enhance the parasitic extraction (PEX) capability to handle multiple substrate thickness options. This method overcomes this problem by incorporating systematic changes in Layout Vs Schematic (LVS) and Parasitic Extraction (PEX) technology files according to the method described in the next section. This method does not require any additional changes in the existing and available vendor tools to support the new methodology. At the same time it solves all the problems detailed in the previous section.

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Page 01 of 3

A Method to Enable Multiple Substrate Thicknesses within a Single Parasitic Technology File

Existing PEX Methodology

Existing PEX Methodology for Multiple Substrate Thicknesses
Multiple Substrate Thicknesses require the PEX process to be repeated "n" times


Page 02 of 3

Proposed PEX Methodology


Page 03 of 3


For Developer:

- Reduced development cycle time

- Simpler methodology

- Reduced susceptibility to quality issues

- For Customer:

- Full compatibility with existing vendor tools & flow

- No additional cost in adapting this method

- Ease of maintenance

- Ease of usage with low susceptibility to user error