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Enhanced Stacked Die Package Disclosure Number: IPCOM000238079D
Publication Date: 2014-Jul-31

Publishing Venue

The Prior Art Database


A lead frame based semiconductor package and method of manufacturing are disclosed. The lead frame has a window type exposed paddle. An embedded substrate interposer serves as a die attach platform. A first silicon die is electrically connected to inner leads of the lead frame and to bonding fingers of the substrate. The first die is encapsulated with part of the die exposed. An external package is mounted on the exposed side of the substrate interposer. The package is singulated by normal or reverse forming options and thermally enhanced by the addition of a heat spreader attached with a thermal adhesive during assembly or SMT (Surface Mount) process, and further by linking the bottom of the package to the board land.