Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Heat Transfer Sockets for Printed Circuit Board Low Profile Cooling

IP.com Disclosure Number: IPCOM000239008D
Publication Date: 2014-Sep-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method for removing inner board heat using a socketed printed circuit board (PCB) with a mating, highly-conductive heat spreader. Regions of high conductivity within the board would have strategically placed sockets that allow for an external member to be inserted in to it. Such an external member would fill the gaps in the PCB and move heat to a surface dissipating heat (such as a heat sink or the surface of a case).