Heat Transfer Sockets for Printed Circuit Board Low Profile Cooling
Publication Date: 2014-Sep-30
The IP.com Prior Art Database
Described is a method for removing inner board heat using a socketed printed circuit board (PCB) with a mating, highly-conductive heat spreader. Regions of high conductivity within the board would have strategically placed sockets that allow for an external member to be inserted in to it. Such an external member would fill the gaps in the PCB and move heat to a surface dissipating heat (such as a heat sink or the surface of a case).