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Heat Transfer Sockets for Printed Circuit Board Low Profile Cooling

IP.com Disclosure Number: IPCOM000239008D
Publication Date: 2014-Sep-30
Document File: 2 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method for removing inner board heat using a socketed printed circuit board (PCB) with a mating, highly-conductive heat spreader. Regions of high conductivity within the board would have strategically placed sockets that allow for an external member to be inserted in to it. Such an external member would fill the gaps in the PCB and move heat to a surface dissipating heat (such as a heat sink or the surface of a case).