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Protection of electronic components via blister packaging

IP.com Disclosure Number: IPCOM000239009D
Publication Date: 2014-Sep-30
Document File: 4 page(s) / 341K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to prevent hardware failures due to harsh environments via blister packaging. Through the use of blister packaging, a component can be protected against chemical exposure, moisture penetration, and particulates, while allowing the component to operate normally under air or an inert gas.