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Conditioning Abrasive Particles for Sapphire Fine Lapping With A Diamond Particle Fixed Abrasive Pad

IP.com Disclosure Number: IPCOM000239231D
Publication Date: 2014-Oct-22

Publishing Venue

The IP.com Prior Art Database

Abstract

A fixed abrasive lapping pad, having diamond agglomerate as the abrasive particle was used to lap C-plane sapphire wafers. A coolant was used that contained platelet calcined alumina, silicon carbide, or boron carbide particles as conditioning particles to condition or dress the fixed abrasive during the lapping process. Sapphire wafers lapped with coolants containing boron carbide conditioning particles have higher removal rates than wafers lapped with a coolant having silicon carbide or alumina conditioning particles. Sapphire wafers lapped with coolants containing silicon carbide conditioning particles have higher removal rates than wafers lapped with alumina conditioning particles.