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Current QFN packages only have IOs on the bottom side. In this paper we present a method of assembling a QFN type package that also has IOs on the package sides.
English (United States)
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Dual In-Surface Package
Current QFN packages only have IOs on the bottom side. In this paper we present a method of
assembling a QFN type package that also has IOs on the package sides.
designs, QFN packages have IOs on the package bottom side, although the leads
in the package body side are also exposed, but they are not independent or
separate IOs. If we need more IOs, we
must enlarge the package size, which will require more room for the device on the
The QFN package shown below (Figure 1) has a substrate with independent
IOs in the bottom and sides, which allows for more IOs without increasing the
Ø Figure 1 shows an example of
a dual in surface package;
Ø Figures 2 – 4 show the
manufacturing flow and inside structure of the dual in surface package; and
Ø Figures 5 – 6 shown the
manufacturing flow to attach the dual in surface package on a PCB board.