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Rotational Server Architecture and Fan Assembly With Blades Comprise of the Electronics

IP.com Disclosure Number: IPCOM000241079D
Publication Date: 2015-Mar-25
Document File: 2 page(s) / 78K

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The IP.com Prior Art Database


Described is a rotational server architecture cooling design that uses a low-pressure floor-to-ceiling airflow though a tubular rack design rotating the entire electronic assemblies moving the server components through the airflow. By using this architecture cooling design, fans from the individual servers can be eliminated, thus saving the electrical energy to run the fans.

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Rotational Server Architecture and Fan Assembly With Blades Comprise of the Electronics

In traditional servers and PCs, circuit boards and the components they comprise are cooled by a plurality of small fans forcing air over them. This arrangement segregates the airflow source from the components which need to be cooled. The difficulty in server cooling design is that not all components receive equal amounts of airflow. For example, some components receive less than adequate cooling because of other components which block the air stream. Others may be starved of airflow when one or more fans fail.

    The rotational server architecture was an attempt to overcome these difficulties. Although a project has not been identified in which the implementation of a rotational server would provide an advantage over traditional 2U and 4U electric server designs, this architecture provides an alternative method of cooling and reduce cooling expense. The architecture described herein comprises rotor "server blades" connected to a central hub which may serve as the main planer providing the connectivity and electrical power to an array of blades. The "server blades", imagined as another form factor of system circuit boards, may include processing, memory, storage and IO, and are plugged into the central hub. This process may be repeated for n "blades" to form a fan. The rotor is slotted about a stator which provides actuation such that the entire assembly can slowly spin. This arrangement guarantees relatively even airflow for all components, as no part is blocked. When the assembly spins, airflow is generated over the components on the circuit board "fan blades." Warmer components (e.g., memory controller modules) may be positioned farther outboard on each blade, providing greater radial velocity and more airflow. For instance, if an assembly 18 inches in diameter rotates at a speed such as 120 rpm, the components would receive up to 560 linear feet per minute of airflow for those on the outer edge. Airflow for components further inboard would decrease linearly...