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Pouch Cell with Integrated Thermal Shim Interface Disclosure Number: IPCOM000244174D
Publication Date: 2015-Nov-19
Document File: 3 page(s) / 276K

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Pouch Cell with Integrated Thermal Shim Interface


Pouch-type Li-ion cells have been emerging in utility for electrified vehicle energy storage by virtue of their potential weight and packaging advantages relative to hard case prismatic and cylindrical cells. This presents a shift in cell-to-pack system integration, especially thermal management solutions. The current state of the art employs a pressure connected cold plate to transfer heat from the cells, which is limited by contact resistances and pressure uniformity. Within this multi-component thermal management solution, pouch cells still exhibit operational thermal gradients. As pouch casing technology continues to mature, there is ample opportunity to integrate heat transfer options onto the cell itself, thus simplifying system structure/assembly and reducing part count.


Traditional pouch case laminate (e.g. polymer/Al/polymer) employs a 40μm to 120μm thick Al layer for structural reinforcement and for thermal conduction during the edge sealing process. The proposed solution utilizes an Al layer that extends beyond the pouch polymer layers acting as a thermal shim to interface with a thermal management system. By doing this, ‘between cell’ cold plates could be reduced or eliminated, changing the thermal management to a more efficient direct convection solution verses the traditional contact conduction to a liquid medium between individual cells. Utilizing an integrated thermal shim greater than 0.3mm thick would enhance thermal spreading across the cell, normalizing thermal gradients and reducing hot spots; however, the thickness of the integrated Al shim would need to be less than 0.5mm to avoid negatively affecting edge seal quality during the cell fabrication process by conducting away localized heating. Therefore, the proposed thermal shim solution would be between 0.3mm and 0.5mm to enhance pouch cell mechanical structure and o...