Browse Prior Art Database

A Method of reducing the TIM BLT using a Jig Disclosure Number: IPCOM000247995D
Publication Date: 2016-Oct-14
Document File: 4 page(s) / 135K

Publishing Venue

The Prior Art Database

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 43% of the total text.

Page 01 of 4

A Method of reducing the TIM BLT using a Jig


In the packaging of integrated circuits, dies may be packaged onto a laminate substrate and then those are encapsulated with molding material. A lid may be attached onto the package or dies. TIM transfers the heat generated by a package or dies to a lid, which then conducts the heat away from the package or dies.

A Die, a substrate, and a lid have different coefficients of thermal expansion (CTE), so that the expansion rate is different. Since the package is prone to warpage caused by the elevated temperature during curing TIM, the warpage may cause irregular joints between a package and a heat spreader. The irregular joints leads to increasing TIM BLT, the thermal resistivity is increased.

Accordingly, it needs to maintain minimal thick of BLT.


The following is the process of attaching a lid on a package using a jig.

Fig. 1 ~ 2 illustrates a schematic cross sectional view of a method of manufacturing conventional flip chip package with exposed die. Fig. 1 shows that a die is attached on a substrate. Components such as capacitor or inductor may be attached on the substrate. The die and the components are electrically connected to the substrate and/or each others.

Fig. 2 shows an encapsulated structure and solder balls mounting. An encapsulant or molding compound is disposed over a die and a substrate using a transfer molding, compression molding, or other suitable applicator. The die may be exposed from the encapsulation. Since the lid is directly attached to a die, the passage of heat flow is short. Accordingly, the heat resistivity is reduced.

The bottom solder balls are attached to the bottom side of the substrate. The bottom solder balls are electrically connected to the die and the components through the substrate.

In other embodiment, the referred process may be applied on a substrate strip. A substrate strip (strip) includes a plurality of substrates. The plurality of dies is attached on the each substrate of the strip, which then is encapsulated. The strip is singulated into a plurality of packages that include each die.

Fig. 3 shows a phase of positioning a package on a lower jig.

A jig may include a lower jig and an upper jig, wherein the lower jig and an upper jig are configured to secure packages with lids. The lower jig may include a first base material, a partition, and a plurality of openings.

Page 02 of 4

A Method of reducing the TIM BLT using a Jig

The Fig. 8 shows the structure of a jig. A first base material is made of a ceramic, a glass, a plastic, a semiconductor material (e.g., silicon, gallium arsenide, etc), a metal, or other materials. A first base material may have any outline shape, including being round, rectangular, or other shape.

The partition divides the first base material to hold each package. The size of each section divided by partition may be enough to allow the package or slightly greater than the the package. The partition m...