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Therma-Flex LED Lighting Substrate

IP.com Disclosure Number: IPCOM000248074D
Publication Date: 2016-Oct-24

Publishing Venue

The IP.com Prior Art Database

Abstract

This publication pertains to thermally efficient flexible printed circuit board constructions, in particular for high power general lighting applications, that can efficiently dissipate the heat, are cost competitive, and are alternative solutions to non-flexible material constructions such as, e.g., a construction including a copper layer on B stage FR-4 on a metal base, or a construction including a copper foil on a thermally conductive polyimide dielectric film on an aluminum sheet.