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ELECTROPLATING PROCESS TO APPLY BOND COATS TO CERAMIC MATRIX COMPOSITES

IP.com Disclosure Number: IPCOM000259267D
Publication Date: 2019-Jul-23

Publishing Venue

The IP.com Prior Art Database

Abstract

The present invention relates generally to the process of applying environmental barrier coatings to ceramic matrix composite (CMC) components, and, more specifically, to the process of using electroplating to apply silicon bond coats onto melt infiltrated CMC components.