Month of April 2001 - Page Number 3

Showing 21 - 30 of 79 from April 2001
Browse Prior Art Database
  1. 21.
    In optical applications, there exists a need to align lens blocks to and among substrates. A lens block in this context includes a body with some symmetrical lens having a focal point. A lens block includes, but is not limited to, an optical fiber having a transmissive core as well as a ribbon of a plurality of...
    IPCOM000004734D | 2001-Apr-24
  2. 22.
    Disclosed is a design for an integrated retention and clipping mechanism for BGA mounted, unsocketed CPU and chipset or onboard graphics cooling. Benefits include support for larger cooling solutions for high-powered BGA devices, placement of BGA solder balls in a state of compression after assembly, and the transfer...
    IPCOM000004733D | 2001-Apr-23
  3. 23.
    Disclosed is a method of workflow to track and solve NAC (electro-static discharge diode) errors and design for debug (DFD) items. Benefits include improved turnaround and productivity.
    IPCOM000004732D | 2001-Apr-23
  4. 24.
    Disclosed is a design for a heat sink clip. Benefits include the assertion of force at a single point sufficient for use with heat sinks designed for 1+ GHz processors.
    IPCOM000004731D | 2001-Apr-23
  5. 25.
    Disclosed is a design for an OEM-friendly thermal test chip for flip-chip application. Benefits include improved uniformity of die heating and similarity of electrical current as the final product without requiring a special test board, external power supply or a test-vehicle-specific package substrate.
    IPCOM000004730D | 2001-Apr-23
  6. 26.
    Disclosed is a method and apparatus for improved impedance control on printed wiring board (PWB) based products. Benefits include an improved reference ground without changes to the commonly available laminate thickness and higher RF design frequencies.
    IPCOM000004729D | 2001-Apr-23
  7. 27.
    Disclosed is a unified design providing a processor thermal solution and mitigation of board vibration. Benefits include improved heat-sink performance, increased effective board stiffening, and reduced vibration-induced board damage.
    IPCOM000004728D | 2001-Apr-23
  8. 28.
    The circuits described here relate generally to drivers of a solid state memory device and in particular to a circuit for controlling slew rates in such drivers.
    IPCOM000004727D | 2001-Apr-23
  9. 29.
    People often receive inquiries via email requesting the same categories of information over and over again. Rather than always bothering the person with having to reply specifically to each occurrence, it would be a benefit to have an automatic response when conditions of applicability and privacy are met. Specific...
    IPCOM000004726D | Original Publication Date: 2001-Apr-23
  10. 30.
    Hardly a day goes by without using an E-mail and Calendar Scheduler program. People are increasingly using these tools to manage their lives. The popularity of wireless email in small devices (PDAs) will increase the need to integrate E-mail and Scheduler functions. This paper discusses a mechanism that enhances the...
    IPCOM000004725D | Original Publication Date: 2001-Apr-23