Month of November 2001 - Page Number 15

Showing 141 - 150 of 290 from November 2001
Browse Prior Art Database
  1. 141.
    Too many failures in post bonding wire pull and peel tests due to inconsistent clamping of leadframes during bond- ing procedure. Any new designs are made difficult by space limitations and the awkward position of corner leads. The Solution Very firm and consistent lead clamping is accomplished by using a new clamping...
    IPCOM000005928D | Original Publication Date: 1990-Mar-01
  2. 142.
    The stability lifetime of the color reflective planar texture as well as the focal-conic transparent texture in a cholesteric display can be adjusted to affect optical and other performance features of a display cell. In cases were video or rapid paging rates are of necessity, the performance of the display may be...
    IPCOM000005927D | 2001-Nov-15
  3. 143.
    A specific set of materials and methods are used to create uniform fluorescent calibration standards over an extremely wide range of fluorescence intensities. These standards can be formulated for a specific optical brightness (OB) level and can be formulated using a variety of optical brighteners and fluorescent...
    IPCOM000005926D | 2001-Nov-15
  4. 144.
    The existing paging entry terminal (AlphaMate) is used predominantly for placing an alphanumeric page. However, in order to place a voice page, it is necessary to use a separate telephone to announce the voice message. This extra telephone is connected in parallel to the AlphaMate.
    IPCOM000005925D | Original Publication Date: 1990-Mar-01
  5. 145.
    Connectors and Pin Grid Arrays provide high signal density but offer little help in controlling crosstalk and impedance. A review of the basic causes of crosstalk is presented and current connector technologies which address the problems of crosstalk and impedance control are examined. A new method for controlling...
    IPCOM000005924D | Original Publication Date: 1990-Mar-01
  6. 146.
    Figure 1 shows a side view of the power stack for a hybrid circuit design. The multilayer substrate is composed of both alumina and copper layers, constructed using direct bond copper (DBC) technology. DBC technology is a method of bonding copper directly to a ceramic substrate, without an additional bonding layer....
    IPCOM000005923D | Original Publication Date: 1990-Mar-01
  7. 147.
    There are several desirable features related to high pin count IC packages such as low manufacturing cost, so&table and immunity to lead damage during handling, testing, burn in and board mounting. In order to achieve the above men- tioned features, plastic packages with peripheral edge contacts have been proposed and...
    IPCOM000005922D | Original Publication Date: 1990-Mar-01
  8. 148.
    During processing of multi-layer structures, the wafer surface often becomes non-planar as shown by the FIG 1 cross-section where the first metal lines are represented by SO8 It is known that the wafer can be replanarized if photoresist is disposed in selected low areas of the dielectric isolation with a mask layer...
    IPCOM000005921D | Original Publication Date: 1990-Mar-01
  9. 149.
    Digital gain control of amplifier circuits is required in the design of many linear circuits. This can be achieved by digitally selecting various feedback resistors, usually employing a DAC, to modify the gain of an op amp circuit. Such a design is limited to low power output, which must be amplified by additional...
    IPCOM000005920D | Original Publication Date: 1990-Mar-01
  10. 150.
    A heat transfer coefficient measurement instrument is used to directly measure the average surface heat transfer coefficient h for electronic packages that are cooled by convection and radiation. The equation below is typically used to define h which is equal to the sum of the convection and radiation heat transfer...
    IPCOM000005919D | Original Publication Date: 1990-Mar-01