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Month of November 2001 - Page Number 3

Showing 21 - 30 of 290 from November 2001
Browse Prior Art Database
  1. 21.
    Endcaps are commonly used in diffusion furnaces to enhance profiling and back pressure capabilities. Prior art endcaps commonly include a plurality of quartz plates arranged in a tiered formation and connected by quartz rods. A handle is attached io the top quartz plate. When inserting this prior art endcap into the...
    IPCOM000006060D | Original Publication Date: 1991-Apr-01
  2. 22.
    Frequency drift of narrowband receivers is a major design concern. Frequency drift over temperature, of superheterodyne receivers is largely caused by two factors: local oscillator drift and i.f. filter drift. These drifts must be compensated by widening the i.f. filters, which in turn degrades receiver selectivity....
    IPCOM000006059D | Original Publication Date: 1991-Apr-01
  3. 23.
    Many phase locked loop oscillators employ a 'Wo Port FM modulation technique. This method consists of applying modulation to both VCO and the reference oscillator.
    IPCOM000006058D | Original Publication Date: 1991-Apr-01
  4. 24.
    Etchback planarization is an integral part of many wafer processing operations. It is widely used in multilevel metallizations and trench isolations. The typical process utilizes a 1:l plasma etchback chemistry for the organic overcoat, e.g. photoresist, to the oxide dielectric. Stopping the etch prior to exposing the...
    IPCOM000006057D | Original Publication Date: 1991-Apr-01
  5. 25.
    IMPROVED SOLDERING TECHNIQUE FOR SURFACE MOUNTED RF POWER DEVICES
    IPCOM000006048D | Original Publication Date: 2001-Nov-28
  6. 26.
    The Hewlett-Packard 3065 Board Test System limits to two hundred the number of volumes1 it can have mounted' at one time. With an alternate approach to volume mounting, the board test engineer can overcome this limit to enable the system to handle many more than two hundred volumes.
    IPCOM000006047D | Original Publication Date: 1991-Apr-01
  7. 27.
    As VLSI process technology advances, registration requirements become more stringent. These requirements are particularly important in applications with a large chip size such as microprocessors, megabit density memories where competitive cell size is critical, and high density gate arrays. One can achieve better...
    IPCOM000006046D | Original Publication Date: 1991-Apr-01
  8. 28.
    Graylevel digital image processing techniques are employed in automatic visual interpretation and recognition of product marking and semiconductor package inspection. A mark or label is a group or region of n alpha-numeric characters or patterns, including logos and other symbols. Any solid- connected contiguous blob...
    IPCOM000006045D | Original Publication Date: 1991-Apr-01
  9. 29.
    Two boron ion implantations into a heavily doped phosphorous substrate are used to obtain both a deep junction and an extremely steep junction gradient in addition to a very high boron surface concentration. The first ion implantation step together with the appropriate diffusion cycle sets the junction to...
    IPCOM000006044D | Original Publication Date: 1991-Apr-01
  10. 30.
    There is a need to reduce circuit complexity and component count in silicon circuits that utilize compound semiconductors (in this case gallium phosphide i.e. GaP, and silicon ie Si). In addition, quantum electronic device design in silicon based semiconductors must be able to be cost effective with respect to tooling...
    IPCOM000006043D | Original Publication Date: 1991-Apr-01