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Month of January 2002 - Page Number 3

Showing 21 - 30 of 365 from January 2002
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  1. 21.
    Transmitter turn-on time (TTO) is defined as the terminal users, since it directly affects the inbound chan- time required from the instant that a Push-to-Talk (FIT) nel utilization and capacity. It is difficult to minimize is asserted to the time when the transmitted signal is data-mode lT0 in a two-way radio that is...
    IPCOM000006764D | Original Publication Date: 1993-Mar-01
  2. 22.
    Preliminary data on voice quality for digitally coded high speed, the error correcting code can compensate portable radios indicate that they lose the equivalent of for deep fades provided they only occur a small per- 4 to 8 dB when they are in a slowly moving Rayleigh centage of the time. I believe that an effective...
    IPCOM000006763D | Original Publication Date: 1993-Mar-01
  3. 23.
    In a busy bunked radio system, mobile radio requests for voice channel often get a busy signal, causing the operator to spend time waiting for an available channel and to quickly use the available channel when it is granted before it is reassigned. If the operator's response is slow, the radio must request the voice...
    IPCOM000006762D | Original Publication Date: 1993-Mar-01
  4. 24.
    Electronic devices requiring speakers are faced with the potential problems of integrating the speaker into the schematic.
    IPCOM000006761D | Original Publication Date: 1993-Mar-01
  5. 25.
    The latest development in the PCB industry is the introduction of cladded boards. This is a process whereby a PCB, after the normal tin-lead coating on the solder pads, is printed with solder paste on these pads and reflowed without any component on it (hereafter referred as cladding reflow process). As the paste...
    IPCOM000006760D | Original Publication Date: 1993-Mar-01
  6. 26.
    One of the most important reliability issues in flip chip packaging is the thermo-mechanical stress which is caused by the mismatch of the coefficients of thermal expansion (CTE) between the chip and the substrate. This thermo-mechanical stress can be reduced either by using a substrate material whose CTE matches the...
    IPCOM000006759D | Original Publication Date: 1993-Mar-01
  7. 27.
    This paper presents an algorithm for balancing resource utilization across three resources in the pres- ence of a dynamic request stream. The algorithm presented has several characteristics which make it an attractive solution to hardware design problems involv- ing allocating three resources to multiple requesters....
    IPCOM000006758D | Original Publication Date: 1993-Mar-01
  8. 28.
    Current microprocessor based systems use inter- rupt vectors which contain only one address-that of the start address of an interrupt handler to process the inter- rupt event. An application which uses different vectors to cause execution of the same group of software rou- tines in a variety of orders requires a...
    IPCOM000006757D | Original Publication Date: 1993-Mar-01
  9. 29.
    One manifestation of the increasing global competi- tion in the pager industry is the constant pressure to reduce product sales prices. In order to survive in this type of market, manufactures must reduce their manu- factoring costs as much as possible. Perhaps the most efficient way to reduce the cost of any product...
    IPCOM000006756D | Original Publication Date: 1993-Mar-01
  10. 30.
    DESCRIPTION OF THE CONCEPT The side view of the bumped thermal test chip assem- bly is shown in Figure I. It is proposed to die bond an existing thermal test chip on the top side of an FR-4 board. The die bond material is a high-thermal- conductivity epoxy (for example: silver-filled epoxy). The I/OS from the test...
    IPCOM000006755D | Original Publication Date: 1993-Mar-01