Month of January 2002 - Page Number 9

Showing 81 - 90 of 365 from January 2002
Browse Prior Art Database
  1. 81.
    Partial collapse of a honeycomb core during curing of a composite is known in the industry as "core crush" and is a particularly common reason for rejection of cured panels. Substantial effort and research extending over many years have been directed to eliminating the core crush problem. Some of the better known...
    IPCOM000006700D | 2002-Jan-23
  2. 82.
    The processing of carbon fibers to produce the desired properties from the polymer precursor state to the final carbonized state is a complex and highly technical process. Not only are the basic properties of the carbon fiber per se important but also the application of the proper sizing. Sized fibers used in...
    IPCOM000006699D | 2002-Jan-23
  3. 83.
    The programming of floating gate based Non-Volatile Memory (NVM) cells using Hot Carrier Injection (HCI) programming has been main stream in the semiconductor industry for the last decade. The problem with scalability of the tunnel oxide has limited the operating voltages in flash bitcell programming. Off state...
    IPCOM000006698D | Original Publication Date: 2002-Jan-23
  4. 84.
    A deposited Anti Reflective Coating (DARC) can react with an overlying photoresist. This problem is known as resist poisoning. A process described herein creates a blocking layer between the DARC and the photoresist. This blocking layer prevents the resist poisoning and does not affect the optical properties of the...
    IPCOM000006697D | Original Publication Date: 2002-Jan-23
  5. 85.
    Scatterometry is a method of measuring critical dimensions in the semiconductor manufacturing process. A spectroscopic ellipsometer is used to capture the spectra from a grating of lines and spaces. A modeling and matching process converts the spectra to a measurement. Typical tiling or slotting features that...
    IPCOM000006696D | Original Publication Date: 2002-Jan-23
  6. 86.
    RapidIO requires the following ordering requirements ... 1. Packets arrive with sequential ackids (3-bit field) in increasing order, wrapping back to 0 on overflow. A packet shall only be accepted by the receiving processing element in the sequential order specified by the ackid by returning a packet-accepted control...
    IPCOM000006695D | Original Publication Date: 2002-Jan-23
  7. 87.
    This proposes a method and apparatus for DMA transfer broadcast across multiple interfaces and multiple paper address ranges to improve DMA performance for graphics applications like image processing. The important components of this idea are: a system having multiple interfaces partitioned across different address...
    IPCOM000006694D | Original Publication Date: 2002-Jan-23
  8. 88.
    This proposes a method and apparatus for optimizing direct memory access (DMA) read papers & write transfers of different sizes to maximize system buffer utilization thereby improving the DMA performance. The important components of this idea are: a system having interfaces with different size and alignment...
    IPCOM000006693D | Original Publication Date: 2002-Jan-23
  9. 89.
    Today's System-On-A-Chip (SoC) designs need embedded processors with sophisticated debug and monitoring logic to aid in the design, debug and performance analysis of the system solution. Such processors may include Real-Time Trace, Background Debug, and Real-Time Debug support. Furthermore, today's SoC solutions are...
    IPCOM000006692D | Original Publication Date: 2002-Jan-23
  10. 90.
    Enhanced Reliability of Flip Chip Packages with Organic Substrates by Using Crack Propagation Barriers
    IPCOM000006691D | Original Publication Date: 2002-Jan-23