Month of April 2002 - Page Number 6

Showing 51 - 60 of 369 from April 2002
Browse Prior Art Database
  1. 51.
    The proposed circuit is shown in Figure 1. The intent of this circuit is to take a digital logic signal and filter it such that it has a controlled slew rate and no sharp comers.
    IPCOM000007818D | Original Publication Date: 1996-Aug-01
  2. 52.
    Wafers having non-uniform bond pad reflectivity have caused poor pattern recognition during the wire bond qperation at assembly. The top metal used on discrete semiconductor devices (transistors, Diodes, MOS) is Al or AlSi. Where this top metal is directly over boron doped contact areas, its reflectivity has...
    IPCOM000007817D | Original Publication Date: 1996-Aug-01
  3. 53.
    In a telephone set, a common way to insure that the signal generated in the microphone does not produce any signal in the earphone is achieved by taking the earphone signal between the centre points of a bridge configuration. This bridge is formed by the line impedance Z,, by an hybrid balancing irnped- ante Z,, and...
    IPCOM000007816D | Original Publication Date: 1996-Aug-01
  4. 54.
    The Adept MV controller (Adept Technology, Inc.) is a high performance, general purpose motion controller built around the VME bus. The control- ler operates a real-time multitasking operating sys- tem developed by Adept Technology specifically for robot control. A powerful high-level programming language is tightly...
    IPCOM000007815D | Original Publication Date: 1996-Aug-01
  5. 55.
    In a switch for a catalytic converter heater used in an automobile, it is possible to minimize the energy dissipation of a transient suppressor (Dl) by dissipating a large portion of the load dump energy in one ofthe switching transistors (Ql). This allows use of a smaller, and less expensive, transient sup- pressor...
    IPCOM000007814D | Original Publication Date: 1996-Aug-01
  6. 56.
    Disclosed is a method for time domain reflectometry (TDR) base system for connector testing. Benefits include improved test environment, improved reliability, and decreased defects.
    IPCOM000007812D | 2002-Apr-24
  7. 57.
    Disclosed is a method for embedded plated through-holes (PTHs) in an organic substrate core. Benefits include improved throughput.
    IPCOM000007811D | 2002-Apr-24
  8. 58.
    Disclosed is a method that uses broadside impedance structures to accurately measure layer registration and movement in packaging and PCB fabrication. Benefits include the ability to measure plane shift in a non-destructive way.
    IPCOM000007810D | 2002-Apr-24
  9. 59.
    Disclosed is a method for a heatsink clip design with adjustable attaching forces and self-aligned load. Benefits include improved functionality and improved reliability.
    IPCOM000007809D | 2002-Apr-24
  10. 60.
    Disclosed is a method for ball grid array (BGA) package design. Benefits include improved thermal performance.
    IPCOM000007808D | 2002-Apr-24