Month of April 2002 - Page Number 7

Showing 61 - 70 of 369 from April 2002
Browse Prior Art Database
  1. 61.
    Disclosed is a method for a snap-together casing for CPU packaging with an integrated heat spreader (IHS). Benefits include improved manufacturability and improved reliability.
    IPCOM000007807D | 2002-Apr-24
  2. 62.
    Disclosed is a method for a sliding fillet fork to control overmold as underfill (OMUF) flow to stop die/substrate gap voiding during molding. Benefits include improved reliability
    IPCOM000007806D | 2002-Apr-24
  3. 63.
    Disclosed is a method for a silicon substrate noise isolation technique through package technology. Benefits include improved signal quality and improved performance.
    IPCOM000007805D | 2002-Apr-24
  4. 64.
    Disclosed is a method for interlocking features and a periodic array of metal vias on metal core substrates. Benefits include improved reliability.
    IPCOM000007804D | 2002-Apr-24
  5. 65.
    Disclosed is a method for reusable covered carrier tape. Benefits include improved reliability and improved design flexibility.
    IPCOM000007803D | 2002-Apr-24
  6. 66.
    Disclosed is a method for the controlled redeposition of laser-ablated material to form a thin protective layer over exposed metal. Benefits include improved reliability and improved part tracking.
    IPCOM000007802D | 2002-Apr-24
  7. 67.
    Disclosed is a method for enhancement of cracks in organic materials for x-ray inspection. Benefits include improved test environment and improved reliability.
    IPCOM000007800D | 2002-Apr-24
  8. 68.
    Disclosed is a method for using fiber optics to reroute LED light for color vision inspection at the board level. Benefits include lower cost and a more reliable inspection.
    IPCOM000007799D | 2002-Apr-24
  9. 69.
    Disclosed is a method for consolidating multiple blade ejector keying and grounding into fewer parts, thereby simplifying the card guide assembly. Benefits include lower material and labor costs.
    IPCOM000007798D | 2002-Apr-24
  10. 70.
    The electronics industry is recognizing the requirements for better utilization of the area of printed circuit boards. One means to accomplish this would be to use Integrated Circuit packages which include interconnects which reside underneath the carrier in an array format. One of the more pop- ular formats is the...
    IPCOM000007796D | Original Publication Date: 1996-Aug-01