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Month of July 2002 - Page Number 14

Showing 131 - 140 of 374 from July 2002
Browse Prior Art Database
  1. 131.
    This paper describes a method for updating the meaning of priority values assigned to items when the actual priorities change (increase or decrease) over time, but the assigned priorities are limited in range and remain unchanged over the lifetime of the item. Key to the method is that items will have a limited...
    IPCOM000008887D | Original Publication Date: 1998-Sep-01
  2. 132.
    Disclosed is a method for die-package integration to support ultralow-K integration. Benefits include improved reliability, improved support for future processes, and improved throughput.
    IPCOM000008886D | 2002-Jul-19
  3. 133.
    Disclosed is a method for low effective series resistance (ESR), high frequency tantalum (Ta) capacitors. Benefits include improved performance and improved design flexibility.
    IPCOM000008885D | 2002-Jul-19
  4. 134.
    Disclosed is a method for a high-speed ball-pull metrology that tests the strength of a solder-joint interconnect. Benefits include improved functionality and performance of solder-to-component strength testing, and improved product mechanical robustness, high-yield and high-quality production.
    IPCOM000008884D | 2002-Jul-19
  5. 135.
    Disclosed is a method for a low-cost and reliable flexible vapor chamber (FVC) for laptop cooling. Benefits include improved thermal performance.
    IPCOM000008883D | 2002-Jul-19
  6. 136.
    Disclosed is a method for a ZIF socket with an extended lever for actuation around a heatsink. Benefits include improved functionality and improved usability.
    IPCOM000008882D | 2002-Jul-19
  7. 137.
    Disclosed is a method for a microprocessor (┬ÁP) assembly on a motherboard (MB). Benefits include cost reduction through a simplified manufacturing process and socket elimination.
    IPCOM000008881D | 2002-Jul-19
  8. 138.
    Disclosed is a method for a component package apparatus for optimized high-current power delivery. Benefits include improved power delivery.
    IPCOM000008880D | 2002-Jul-19
  9. 139.
    Disclosed is a method for a surface-mount ceramic spacer. Benefits include reductions in cost and through-put time at the capacitor manufacturers facility.
    IPCOM000008879D | 2002-Jul-19
  10. 140.
    Disclosed is a method for an integrated input/output (I/O) connection socket. Benefits include improved design flexibility, improved test and inspection, and improved manufacturability.
    IPCOM000008878D | 2002-Jul-19