Month of July 2002 - Page Number 5

Showing 41 - 50 of 376 from July 2002
Browse Prior Art Database
  1. 41.
    Method for a preloaded buckling beam land grid array (LGA) contact. Benefits include improved performance.
    IPCOM000008977D | 2002-Jul-26
  2. 42.
    Disclosed is a method for a cross-beam contact for an electronic socket. Benefits include improved performance and improved reliability.
    IPCOM000008976D | 2002-Jul-26
  3. 43.
    Disclosed is a method for equipment for folding of tape substrate semiconductor packages. Benefits include improved functionality and improved throughput.
    IPCOM000008975D | 2002-Jul-26
  4. 44.
    Disclosed is a method that uses a quick latch mechanism and combined package types to improve upon the JLSI package conversion process. Benefits include a reduction in conversion time.
    IPCOM000008974D | 2002-Jul-26
  5. 45.
    Disclosed is a method that uses gold-plated pads and a spring loaded pinned socket to replace the pins that connect to the motherboard of a CPU. Benefits include a reduction in damaged pins and returned materials.
    IPCOM000008973D | 2002-Jul-26
  6. 46.
    Disclosed is a method for a microprocessor package with lossy polymer gel-filled IHS cavity and lossy polymer dam around a silicon die. Benefits include improved signal quality and improved thermal performance.
    IPCOM000008972D | 2002-Jul-26
  7. 47.
    Disclosed is a method for a surface-mount solder apparatus for reducing equivalent series resistance (ESR) and equivalent series inductance (ESL) in PGA sockets. Benefits include improved power performance, improved resistance and inductance, and improved use of silicon surface area.
    IPCOM000008971D | 2002-Jul-26
  8. 48.
    Disclosed is a method for a carbon fiber enhanced heat-spreading strap. Benefits include improved thermal performance.
    IPCOM000008970D | 2002-Jul-26
  9. 49.
    Disclosed is a method for using a vacuum seal to mechanically couple a chassis to a motherboard. Benefits include improved reliability.
    IPCOM000008969D | 2002-Jul-26
  10. 50.
    Disclosed is a method for a printed circuit manufacturing apparatus for improved component power delivery for high-power logic devices. Benefits include improved power performance, improved thermal performance, and improved reliability.
    IPCOM000008968D | 2002-Jul-26