Month of August 2002 - Page Number 4

Showing 31 - 40 of 410 from August 2002
Browse Prior Art Database
  1. 31.
    Disclosed is a method for an electronic package assembly carrier that reduces package warpage. Benefits include improved performance.
    IPCOM000009508D | 2002-Aug-28
  2. 32.
    Disclosed is a method for heatsink attachment that improves ball-grid array (BGA) reliability. Benefits include improved reliability.
    IPCOM000009507D | 2002-Aug-28
  3. 33.
    Disclosed is a method for power supply decoupling for 1-mm pitch ball-grid array (BGA) packaging. Benefits include improved performance.
    IPCOM000009506D | 2002-Aug-28
  4. 34.
    Disclosed is a method for using composite pillars for creating a compliant connection in a coreless package. Benefits include improved performance and improved design flexibility.
    IPCOM000009505D | 2002-Aug-28
  5. 35.
    Disclosed is a method for fatigue failure recovery through grain recrystallization. Benefits include improved reliability.
    IPCOM000009504D | 2002-Aug-28
  6. 36.
    Disclosed is a method for straight-edge copper meshing to fill incomplete squares with copper on matrix-molded area package (MMAP) strips. Benefits include improved reliability.
    IPCOM000009503D | 2002-Aug-28
  7. 37.
    Disclosed is a method for a rotating comb thermal hinge. Benefits include improved thermal performance.
    IPCOM000009502D | 2002-Aug-28
  8. 38.
    Disclosed is a method for a universal heatsink support jig. Benefits include improved functionality and improved ease of manufacturing.
    IPCOM000009501D | 2002-Aug-28
  9. 39.
    Disclosed is a method for a processor pin field shroud. Benefits include improved reliability and improved design flexibility.
    IPCOM000009500D | 2002-Aug-28
  10. 40.
    Disclosed is a method for a torque-sensitive load application for a heatsink clip. Benefits include improved design flexibility and improved ease of manufacturing.
    IPCOM000009499D | 2002-Aug-28