Month of October 2002 - Page Number 11

Showing 101 - 110 of 180 from October 2002
Browse Prior Art Database
  1. 101.
    Key Words Trench, substrate contact, trench capacitor, coupling, bypass Background High-density bypass capacitors are of great importance in modern integrated circuits as they help reduce costs, help reduce variability associated with external components and also provide for more flexible design methodology. Trench...
    IPCOM000010089D | 2002-Oct-17
  2. 102.
    Current statistical formulas used to predict process capability from continuous data regard all dimensional specifications as having constant tolerance while many of them are variable. Geometric tolerances and datum feature designations followed by the tolerance modification symbols ? or ? permit a variable "bonus"...
    IPCOM000010088D | 2002-Oct-17
  3. 103.
    Disclosed is a method for an apparatus for reducing impedance in printed wire boards (PWBs). Benefits include improved performance.
    IPCOM000010087D | 2002-Oct-17
  4. 104.
    IPCOM000010084D | Original Publication Date: 2002-Oct-17
  5. 105.
    Disclosed is a method for bond pads over redistribution layers (RDLs) for wire bonding (WB). Benefits include improved reliability.
    IPCOM000010073D | 2002-Oct-16
  6. 106.
    Disclosed is a method that uses a thin board apparatus which can be fully or partially processed in the same manner as a PCB, with a thickness that matches the via fill percent to be tested in PCB boards. Benefits include correcting filling process errors before the plugging material has cured.
    IPCOM000010070D | 2002-Oct-16
  7. 107.
    Disclosed is a method with the following two elements: · A process to attach surface mount components to any substrate, board, or package · A process to hold the surface mount components in place during the reflow process Benefits include placement of all surface mount components in a single process step instead of...
    IPCOM000010069D | 2002-Oct-16
  8. 108.
    Disclosed is a method for a surface-mount socket standoff gap. Benefits include improved performance and improved ease of implementation and manufacturing.
    IPCOM000010068D | 2002-Oct-16
  9. 109.
    Disclosed is a method for an integrated heat spreader and Faraday cage structure for improved thermal/electrical performance. Benefits include improved thermal performance and improved performance.
    IPCOM000010067D | 2002-Oct-16
  10. 110.
    Disclosed is a structure for a lifted compliant die-package interconnect along with a method for creating it. Benefits include improved reliability and improved ease of manufacturing over other proposed compliant interconnects.
    IPCOM000010066D | 2002-Oct-16