Month of October 2002 - Page Number 14

Showing 131 - 140 of 180 from October 2002
Browse Prior Art Database
  1. 131.
    An improved process to prepare hard drive media disc for the deposition of the magnetic layer, wherein the removal rate and surface texture are controllable and adjustable through pressure and chemical formulation. In this process, a diamond containing slurry is used to accomplish the goal of pre-texturing polish.
    IPCOM000010037D | 2002-Oct-10
  2. 132.
    An improved fabrication technique to bond cemented carbide supported abrasive compacts (including polycrystalline diamond and/or cubic boron nitride) to cemented carbide with a filler metal which has a liquidus temperature substantially higher than the degradation temperature of the abrasive in the compact
    IPCOM000010036D | 2002-Oct-10
  3. 133.
    Disclosed is a method for an asynchronous FIFO featuring different-sized write and read data ports. Benefits include improved functionality.
    IPCOM000010034D | 2002-Oct-09
  4. 134.
    Disclosed is a method for a fast and small linear interpolator, multiplier, adder, and subtracter. Benefits include improved performance.
    IPCOM000010032D | 2002-Oct-09
  5. 135.
    Disclosed is a method for a noise-immune passgate MUX-latch. Benefits include improved performance and noise susceptibility.
    IPCOM000010031D | 2002-Oct-09
  6. 136.
    Disclosed is a method for transmitter in-phase/quadrature (I/Q) imbalance correction with digital down-conversion. Benefits include improved performance.
    IPCOM000010030D | 2002-Oct-09
  7. 137.
    Disclosed is a method for an add-in card to utilize either a locally generated or a system generated voltage reference. Benefits include improved performance and improved design flexibility.
    IPCOM000010029D | 2002-Oct-09
  8. 138.
    Disclosed is a method for a scroll strip. Benefits include improved ease of use and improved reliability.
    IPCOM000010028D | 2002-Oct-09
  9. 139.
    Disclosed is a method for a smart wall wart. Benefits include improved functionality and improved useability.
    IPCOM000010027D | 2002-Oct-09
  10. 140.
    A stable, well-dispersed suspension formulation comprising diamond micron powder with a specially formulated mixture of water and organic compounds for use in lapping applications for semiconductor wafers / the chemical mechanical planarization of semiconductor circuits, for superior removal rates and surface finishes...
    IPCOM000010026D | 2002-Oct-09