Month of October 2002 - Page Number 18

Showing 171 - 180 of 180 from October 2002
Browse Prior Art Database
  1. 171.
    Disclosed is a method that uses an asymmetrical socket center cavity, landside caps, and motherboard caps for better placement of the die, and to accommodate an increased number of pins. Benefits include improved electrical signal routing and reducing packaging costs.
    IPCOM000009970D | 2002-Oct-02
  2. 172.
    Disclosed is a method for a split plated through-hole (PTH) structure for enhanced power delivery in multi-power processor systems. Benefits include improved inductance, improved power performance, and improved design flexibility.
    IPCOM000009969D | 2002-Oct-02
  3. 173.
    Disclosed is a method for creating a probe attachment mechanism (PAM) test tool that measures the surface temperature beneath the heat sink of packages and board surfaces. The disclosed method requires no glue or extensive preparation, and it also improves the accuracy of measuring temperatures.
    IPCOM000009968D | 2002-Oct-02
  4. 174.
    Disclosed is a method to create a substrate to enable the application of a backside heat sink. Benefits include easy attachment and effective heat transfer.
    IPCOM000009967D | 2002-Oct-02
  5. 175.
    Disclosed is a method for the use of press molds to create cavity features in thermoset dielectrics. Benefits include improved functionality, improved ease of manufacturing, and improved reliability.
    IPCOM000009966D | 2002-Oct-02
  6. 176.
    Disclosed is a method for thermal enhancement of low-profile packages by utilizing electromagnetic interference (EMI) metal shielding or a metal heat spreader. Benefits include improved thermal performance.
    IPCOM000009965D | 2002-Oct-02
  7. 177.
    Disclosed is a method for creating a control barrier to prevent die attach bleed out. The method prevents bleed out by applying additional soldermask, or by creating a trough in the soldermask. Benefits include improved assembly yield and an increase in wirebound reliability.
    IPCOM000009964D | 2002-Oct-02
  8. 178.
    RF power combining loads can be large and costly. Their purpose in a coherent combining system is to provide isolation to the other circuits “to be combined”. They also must perform this isolation function in the event one or more of the circuits “to be combined” fails. If the circuits “to be combined” are active...
    IPCOM000009963D | Original Publication Date: 2002-Oct-02
  9. 179.
    An approach to better handling repettive errors reported during simulation-based verification of an integrated circuit layout is described. This reduces the manual review, or inspection, time spent on going through the output of the verification.
    IPCOM000009959D | 2002-Oct-01
  10. 180.
    The invention consists of a process that aligns the architectures of subsystems to cultivate the emergent capabilities of the resultant overall system. Although the process is applied to a product development system comprised of a product development organization, the product it produces, and the product development...
    IPCOM000009955D | 2002-Oct-01