Month of December 2002 - Page Number 8

Showing 71 - 80 of 155 from December 2002
Browse Prior Art Database
  1. 71.
    Disclosed is a method for molding thin microprocessor molded matrix array packages (MMAPs) for flip-chip dies. Benefits include improved reliability.
    IPCOM000010574D | 2002-Dec-18
  2. 72.
    Disclosed is a method for a wafer-flipper cassette. Benefits include improved functionality and improved reliability.
    IPCOM000010573D | 2002-Dec-18
  3. 73.
    Disclosed is a method that uses a process vacuum to temporarily hold the die in place during wire bonding. Benefits include simplifying the assembly process and reducing material costs.
    IPCOM000010572D | 2002-Dec-18
  4. 74.
    Disclosed is a method that applies a thin layer of gold to the cavity of integral heat spreader, using a sputter or evaporation deposition process. Benefits include lower manufacturing costs and improved package thermal-mechanical performance.
    IPCOM000010571D | 2002-Dec-18
  5. 75.
    Disclosed is a method that uses a solder mask design to bridge the balls in the BGA plane areas of a PCB. Benefits include a controlled method for bridging multiple balls together by altering the solder mask.
    IPCOM000010570D | 2002-Dec-18
  6. 76.
    Disclosed is a method for on-board local area network (LAN) data included in a firmware hub (FWH) via system BIOS. Benefits include improved usability and improved design flexibility.
    IPCOM000010569D | 2002-Dec-18
  7. 77.
    IPCOM000010567D | Original Publication Date: 2002-Dec-18
  8. 78.
    IPCOM000010566D | Original Publication Date: 2002-Dec-18
  9. 79.
    A system for building conference agendas, which handles the tedious planning tasks of putting together a schedule without conflicts. It manages all the components of a conference to prevent omissions or errors.
    IPCOM000010565D | Original Publication Date: 2002-Dec-18
  10. 80.
    IPCOM000010554D | 2002-Dec-17