Month of February 2003 - Page Number 3

Showing 21 - 30 of 207 from February 2003
Browse Prior Art Database
  1. 21.
    Disclosed is a method for a closed loop liquid cooling system for a hot-swappable Advanced Telecom Computing Architecture (ATCA) blade computer with a uniform airflow-directing heat exchanger. Benefits include improved functionality due to enabling higher heat dissipating devices in smaller form factors while...
    IPCOM000011516D | 2003-Feb-26
  2. 22.
    Disclosed is a method for a heatsink with an integrated thermoelectric cooler (TEC) and a tapered base. Benefits include improved thermal performance, improved functionality, and improved reliability.
    IPCOM000011515D | 2003-Feb-26
  3. 23.
    Disclosed is a method for a hexagonal heatsink fin. Benefits include improved thermal performance.
    IPCOM000011514D | 2003-Feb-26
  4. 24.
    Disclosed is a method for a liquid injection molded (LIM) electronics package. Benefits include improved reliability, improved functionality, improved throughput, and improved ease of manufacturing.
    IPCOM000011513D | 2003-Feb-26
  5. 25.
    Disclosed is a method for an interconnect adaptor card (IAC). Benefits include improved functionality, improved performance, improved power performance, and improved design flexibility.
    IPCOM000011512D | 2003-Feb-26
  6. 26.
    Disclosed is a method for a duct with a self-adjusting and balancing fluid flow device. Benefits include improved thermal performance, improved functionality, and improved system performance.
    IPCOM000011511D | 2003-Feb-26
  7. 27.
    Disclosed is a method for a cable discharge apparatus for network equipment connectors. Benefits include improved reliability.
    IPCOM000011510D | 2003-Feb-26
  8. 28.
    Disclosed is a method to attach capacitors to a substrate with solder joints under the capacitor. Benefits include increased capacitor density and reduced inductance.
    IPCOM000011509D | 2003-Feb-26
  9. 29.
    Disclosed is a method for measuring force/displacement data for an E15-type loadport. Benefits include improved functionality.
    IPCOM000011508D | 2003-Feb-26
  10. 30.
    Disclosed is a method for a sealed cell assembly on silicon. Benefits include improved ease of manufacturing and improved usability.
    IPCOM000011507D | 2003-Feb-26