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Month of February 2003 - Page Number 9

Showing 81 - 90 of 207 from February 2003
Browse Prior Art Database
  1. 81.
    IPCOM000011439D | Original Publication Date: 2003-Feb-20
  2. 82.
    A simulcast channel controller in a wireless communications system is required to continuously pace out transmit payload packets at an average rate that corresponds exactly to the downstream air interface data rate. The controller must be able to continue this indefinitely since there is no limit on the duration for...
    IPCOM000011438D | Original Publication Date: 2003-Feb-19
  3. 83.
    Disclosed is a method to detect dropped video frames during playback by marking the original frames. Benefits include improved video quality, improved performance, and an improved development environment.
    IPCOM000011437D | 2003-Feb-19
  4. 84.
    Disclosed is a method for translation and protection table (TPT) cache-line locking in a multi-threaded host channel adapter (HCA). Benefits include improved performance and improved reliability.
    IPCOM000011436D | 2003-Feb-19
  5. 85.
    Disclosed is a method for a multitasking direct memory access (DMA) controller. Benefits include improved performance and improved power performance.
    IPCOM000011435D | 2003-Feb-19
  6. 86.
    Disclosed is a method for a carbon nanotube single electron transistor (SET) scanning probe electrometer. Benefits include improved performance, improved functionality, improved ease of implementation, and improved ease of manufacturing.
    IPCOM000011434D | 2003-Feb-19
  7. 87.
    Disclosed is a method that uses a simplified, universal mechanical test board (MTB), which has a similar form factor, design, and layout as other BGA packages. Benefits include reduced costs for board designs, and during the environmental stress test.
    IPCOM000011433D | 2003-Feb-19
  8. 88.
    Disclosed is a method for an improved heatsink for active thermal control (ATC) during testing with the objective of minimizing device temperature rise during test. Benefits include improved functionality, improved performance, and an improved test environment.
    IPCOM000011432D | 2003-Feb-19
  9. 89.
    Disclosed is a method for a package using wirebond and flip-chip interconnects with silicon vias. Benefits include improved power performance and improved design flexibility.
    IPCOM000011431D | 2003-Feb-19
  10. 90.
    Disclosed is a method to reduce the Dk variation by matching the dielectric constants (Dks) of the laminate’s woven material with the fill material. Benefits include improved performance.
    IPCOM000011430D | 2003-Feb-19