Month of May 2003 - Page Number 1

Showing 1 - 10 of 340 from May 2003
Browse Prior Art Database
  1. 1.
    IPCOM000012833D | Original Publication Date: 2003-May-31
  2. 2.
    Disclosed is an electroless plating method to repair barrier or liner defects in interconnect structures with copper wiring. The method is defect-localized in that it adds new barrier material only to places where Cu is exposed.
    IPCOM000012832D | Original Publication Date: 2003-May-30
  3. 3.
    It is shown how the use of photosensitive dielectric materials can simplify the fabrication of certain air-gap-containg interconnect structures.
    IPCOM000012831D | Original Publication Date: 2003-May-30
  4. 4.
    A modulated metal microstructure for improved wet etch taper control or for the formation of an interdigitated electrode for a capacitor is disclosed. Layers of a pure refractory metal, such as Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, or alloys thereof are alternated with thin layers of the same refractory metal or alloy...
    IPCOM000012830D | Original Publication Date: 2003-May-30
  5. 5.
    An image sensor includes a substrate for forming a support structure; a plurality of photosensitive areas disposed in a cavity of the substrate so that a lip is formed enclosing at least a portion of the photosensitive areas; and a light-transmitting tape having an adhesive side removably attached to the lip and...
    IPCOM000012829D | 2003-May-30
  6. 6.
    A method for forming an abrasive particle matrix commences by forming a mixture of a silicon carbide (SiC) precursor resin and abrasive particles into a coherent mass. The coherent mass is pyrolized at a temperature below the thermal degradation temperature of the abrasive particles to convert the precursor resin...
    IPCOM000012827D | 2003-May-30
  7. 7.
    IPCOM000012810D | Original Publication Date: 2003-May-29
  8. 8.
    This invention describes the use of one or more FGPA blocks within a System On A Chip (SOC) to translate between different networking protocols. The fixed portions of the SOC such as a processor and memory controller then may be optimized for size, power, etc. This approach allows a single chip part number to be...
    IPCOM000012809D | Original Publication Date: 2003-May-29
  9. 9.
    IPCOM000012808D | Original Publication Date: 2003-May-29
  10. 10.
    The joining of organic substrates and silicon dice that have very different coefficients of thermal expansion (CTE) generates stress on the solder joint during assembly cooling from the solder solidification temperature. The stress in the joints is a function of the distance of the joint from the neutral point (DNP)....
    IPCOM000012807D | Original Publication Date: 2003-May-28