Month of August 2003 - Page Number 2

Showing 11 - 20 of 250 from August 2003
Browse Prior Art Database
  1. 11.
    Disclosed is a method that uses a helical coil as a pin to connect a high-density interconnect (HCD) socket to a printed circuit board (PCB). Benefits include a more reliable connection between the components.
    IPCOM000019067D | 2003-Aug-27
  2. 12.
    Disclosed is a method for an error-free barcode scanning fixture. Benefits include improved productivity.
    IPCOM000019066D | 2003-Aug-27
  3. 13.
    Disclosed is a method for a multiport flag universal serial bus (USB) type-A and IEEE 1394 connector. Benefits include improved functionality.
    IPCOM000019065D | 2003-Aug-27
  4. 14.
    Disclosed is a method for die size growth/die-side component placement through a land-grid array (LGA) package integrated heat spreader (IHS). Benefits include improved performance, improved process flexibility, and improved ease of implementation.
    IPCOM000019064D | 2003-Aug-27
  5. 15.
    Disclosed is a method for memory probing on a multiple dual inline memory module (DIMM) bus. Benefits include improved functionality and an improved test environment.
    IPCOM000019063D | 2003-Aug-27
  6. 16.
    Disclosed is a method for a modular active-probe device. Benefits include an improved test environment and improved functionality.
    IPCOM000019062D | 2003-Aug-27
  7. 17.
    Disclosed is a method for a fluxless molten solder bump process. Benefits include improved reliability and improved performance.
    IPCOM000019061D | 2003-Aug-27
  8. 18.
    Disclosed is a method for a hybrid ceramic/organic flip-chip (FC) package for improved thermo-mechanical performance and high-density signal routing. Benefits include improved performance.
    IPCOM000019060D | 2003-Aug-27
  9. 19.
    Disclosed is a method for a land-grid array (LGA) package socket assembly with a threaded socket cap and integrated load ring. Benefits include improved design simplicity, improved ease of manufacturing, and improved ease of use.
    IPCOM000019059D | 2003-Aug-27
  10. 20.
    Disclosed is a method for an integrated positive-stop mechanism to prevent incorrect land-grid-array (LGA) package orientation and socket actuation. Benefits include improved yield and improved reliability.
    IPCOM000019058D | 2003-Aug-27