Month of August 2003 - Page Number 3

Showing 21 - 30 of 250 from August 2003
Browse Prior Art Database
  1. 21.
    Disclosed is a method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.
    IPCOM000019057D | 2003-Aug-27
  2. 22.
    Disclosed is a method for a fusible solder-coated spherical electrical interconnect standoff. Benefits include improved process simplification.
    IPCOM000019056D | 2003-Aug-27
  3. 23.
    Disclosed is a method for three-dimensional (3-D) computing. Benefits include improved performance, improved process simplicity, and improved support for future technology.
    IPCOM000019055D | 2003-Aug-27
  4. 24.
    Disclosed is a method for a metal-encapsulated capacitor structure. Benefits include improved performance.
    IPCOM000019054D | 2003-Aug-27
  5. 25.
    Disclosed is a method for a decoupling capacitor using a multiface terminal. Benefits include improved performance.
    IPCOM000019053D | 2003-Aug-27
  6. 26.
    Disclosed is a method for an audio jack and two universal serial bus (USB) ports in a single housing. Benefits include improved functionality.
    IPCOM000019052D | 2003-Aug-27
  7. 27.
    Disclosed is a method for a multiport flag universal serial bus (USB) type-A connector. Benefits include improved functionality.
    IPCOM000019051D | 2003-Aug-27
  8. 28.
    Disclosed is a method for surface-mount technology (SMT) passive components. Benefits include improved yield and improved process robustness.
    IPCOM000019050D | 2003-Aug-27
  9. 29.
    Disclosed is a method for a thermal interface material/underfill hybrid material and a one-step assembly process. Benefits include improved process simplification, improved yield, improved performance.
    IPCOM000019049D | 2003-Aug-27
  10. 30.
    Disclosed here is a method for transporting television viewer preference information while traveling, including channel selection vehicles.
    IPCOM000019047D | Original Publication Date: 2003-Aug-27