Month of October 2003 - Page Number 2

Showing 11 - 20 of 366 from October 2003
Browse Prior Art Database
  1. 11.
    A generalized data set comparison is performed which identifies "logical matching" in datasets which may not "physically match". Control statements are utilized by which the algorithms for what constitutes a logical match can be defined. Ignoring the expected differences allows focus on unknown differences, or...
    IPCOM000020174D | Original Publication Date: 2003-Oct-29
  2. 12.
    Disclosed is a method that adds a buffer chip on a memory module; the chip has a narrow, high-speed interface on the host side and a wider DDR/DDR2/DDR3 interface on the DRAM side. Benefits include new opportunities for functional testing, and the debugging of the data stream on the memory module.
    IPCOM000020173D | 2003-Oct-29
  3. 13.
    Disclosed is a method for wave solder fan attachment. Benefits include improved functionality, improved reliability, improved performance, and improved design flexibility.
    IPCOM000020172D | 2003-Oct-29
  4. 14.
    Disclosed is a method for wire-bonded spacers for exact bond-line thickness (BLT) control of thermal interface materials (TIMs). Benefits include improved functionality, improved reliability, and improved performance.
    IPCOM000020171D | 2003-Oct-29
  5. 15.
    Disclosed is a method for an RS-232 power-monitoring device. Benefits include improved functionality and improved reliability.
    IPCOM000020170D | 2003-Oct-29
  6. 16.
    Disclosed is a method that uses a stiffening device that can be placed near a package or component. Benefits include reducing board flexure and maintaining reliability and mechanical integrity.
    IPCOM000020169D | 2003-Oct-29
  7. 17.
    Disclosed is a method for embedding Cu-Au balls along the bump pitch inside an underfill sheet between the die and substrate join, connecting the die and substrate with a bumpless structure. Benefits include improving process yield, and reducing material and process costs.
    IPCOM000020168D | 2003-Oct-29
  8. 18.
    Disclosed is a method of reducing PCB board size by stamping cavities in standard cavity-down QFP heat spreaders, and inserting small BGA and/or CSP packages inside the cavity beneath the QFP package. Benefits include reducing board size and using existing equipment and processes.
    IPCOM000020167D | 2003-Oct-29
  9. 19.
    Disclosed is a method for stacking dice with center bond pads. Benefits include improved reliability and improved performance.
    IPCOM000020166D | 2003-Oct-29
  10. 20.
    Disclosed is a method for a flip-chip matrix array package (FC-MAP) integrated heat spreader (IHS). Benefits include improved functionality, improved process simplicity, and improved reliability.
    IPCOM000020165D | 2003-Oct-29