Month of October 2003 - Page Number 3

Showing 21 - 30 of 366 from October 2003
Browse Prior Art Database
  1. 21.
    Disclosed is a method for a flexible circuit interposer for test point accessibility at the dynamic random access memory (DRAM) package and memory module interface for double data rate (DDR) III. Benefits include improved functionality, improved reliability, and an improved development environment.
    IPCOM000020164D | 2003-Oct-29
  2. 22.
    Disclosed is a method for a stepped integrated heat spreader (IHS) structure on notched/trenched silicon. Benefits include improved thermal performance and improved reliability.
    IPCOM000020163D | 2003-Oct-29
  3. 23.
    Disclosed is a method for a 3 port 1394 connector with an integrated 1394 hub. Benefits include improved functionality.
    IPCOM000020162D | 2003-Oct-29
  4. 24.
    Disclosed is a method for an unshielded magnetic loop-type antenna for embedding into a machine as a default real-time electrostatic discharge (ESD) monitor tool. Benefits include improved functionality and an improved manufacturing environment.
    IPCOM000020161D | 2003-Oct-29
  5. 25.
    Disclosed is a method for a retractable safety barricade pole. Benefits include improved reliability, improved user experience, and improved environment.
    IPCOM000020160D | 2003-Oct-29
  6. 26.
    Disclosed is a method for a clip on retention spring for process carriers. Benefits include improved functionality.
    IPCOM000020159D | 2003-Oct-29
  7. 27.
    Disclosed is a method for a micro pin grid array (mPGA) zero insertion force (ZIF) socket deactuation mechanism. Benefits include improved performance and improved reliability.
    IPCOM000020158D | 2003-Oct-29
  8. 28.
    Disclosed is a method for glued ball grid array (BGA) or land grid array (LGA) socket and backplate. Benefits include improved functionality, improved performance, and improved cost effectiveness.
    IPCOM000020157D | 2003-Oct-29
  9. 29.
    Disclosed is a method for a recursive die-attach monitor. Benefits include improved functionality.
    IPCOM000020156D | 2003-Oct-29
  10. 30.
    Disclosed is a method to create a contact on the edge of a flip-chip integrated circuit (IC) package. Benefits include improved functionality and increased contact without a commensurate increase in substrate size.
    IPCOM000020155D | 2003-Oct-29