-
1.IPCOM000030187D | Original Publication Date: 2004-Jul-31
-
2.IPCOM000030178D | 2004-Jul-30
-
3.Disclosed is a method for charge induced in-place protection of metal during wet cleaning. Benefits include improved functionality.IPCOM000030177D | 2004-Jul-30
-
4.Disclosed is a method for high-density plasma (HDP) v-springs. Benefits include improved performance, improved productivity, and improved cost effectiveness.IPCOM000030175D | 2004-Jul-30
-
5.Disclosed is a method for a linear nonintrusive flow restrictor. Benefits include a much finer flow adjustment and improved performance.IPCOM000030174D | 2004-Jul-30
-
6.Disclosed is a method for the identification of reticle photo-induced contaminants and pellicle degradation. Benefits include improved functionality and improved performance.IPCOM000030173D | 2004-Jul-30
-
7.Disclosed is a method for pore sealing by selective polymer growth on mixed substrates. Benefits include improved functionality and improved performance.IPCOM000030172D | 2004-Jul-30
-
8.Disclosed is a method for a wafer hole. Benefits include improved functionality.IPCOM000030171D | 2004-Jul-30
-
9.Disclosed is a method for low power, low temperature oxide for a polished interlayer dielectric (ILD). Benefits include improved functionality and improved performance.IPCOM000030170D | 2004-Jul-30
-
10.Disclosed is a method for removing small particles from extreme ultraviolet (EUV) photomasks. Benefits include improved functionality, improved performance, and improved power performance.IPCOM000030169D | 2004-Jul-30