Month of December 2004 - Page Number 1

Showing 1 - 10 of 414 from December 2004
Browse Prior Art Database
  1. 1.
    An AED can be designed to accommodate a faceplate that can be customized to a customer's wishes to display branding, names, logo or other indicia. Customized faceplates could be ordered on a website that provided templates for customized design. Customized faceplates for AEDs can be used to encourage sponsorship...
    IPCOM000033874D | 2004-Dec-31
  2. 2.
    IPCOM000033873D | Original Publication Date: 2004-Dec-31
  3. 3.
    Disclosed is a solution for a harness-like wearable system that ergonomically facilitates and eases the transportation and use of a computer tablet.
    IPCOM000033872D | Original Publication Date: 2004-Dec-30
  4. 4.
    Disclosed is a method that uses a restrainer clip with an optimized force to help reduce package co-planarity during the underfill epoxy cure process. Benefits include a solution that can be modified for a variety of packages.
    IPCOM000033871D | 2004-Dec-30
  5. 5.
    Disclosed is a method that embeds higher performance materials and/or substrates into a conventional multilayer PCB. Benefits include being able to alter locally the electrical and mechanical properties of a PCB.
    IPCOM000033870D | 2004-Dec-30
  6. 6.
    Disclosed is a method for using an optical fiber to re-direct light down a hole in the PCB. The fiber is severed at a 45o angle, polished, and mirrored to reflect down the severed end of the fiber. Benefits include a solution that eliminates impedance and power issues, and produces less noise than the current state of...
    IPCOM000033869D | 2004-Dec-30
  7. 7.
    Disclosed is a method that uses a high-temperature polymer wafer media to process ultra thin wafers through a solder paste machine and a high-convection reflow oven. Benefits include a solution that safeguards the ultra thin wafers from scratches, cracks, and mishandling.
    IPCOM000033868D | 2004-Dec-30
  8. 8.
    Disclosed is a method that improves the solder joint strength at the second level interconnects by using micro-fiberglass laid across the pad opening and the SRO.
    IPCOM000033867D | 2004-Dec-30
  9. 9.
    Disclosed is a method for a low-friction, fully supported roller assembly for straight line contacts. Benefits include simplifying the assembly process and reducing manufacturing costs.
    IPCOM000033866D | 2004-Dec-30
  10. 10.
    Disclosed is a method that provides improved thermal impact resistance for existing ultra high temperature (UHT) trays. Benefits include a solution that can work with a variety of form factors.
    IPCOM000033865D | 2004-Dec-30