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InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.

Month of December 2004 - Page Number 2

Showing 11 - 20 of 414 from December 2004
Browse Prior Art Database
  1. 11.
    Disclosed is a method that incorporates a rubber fan blade and hub support into the current computer system fan design. Benefits include reducing noise from the fan hub to the peripheral frame.
    IPCOM000033864D | 2004-Dec-30
  2. 12.
    Disclosed is a method that modifies the existing flip chip package design so that it accepts the shrink version of the silicon die. Benefits include a faster throughput time.
    IPCOM000033863D | 2004-Dec-30
  3. 13.
    Disclosed is a method for a groove ring on a connection pad for better solder joint reliability. Benefits include improved performance and improved reliability.
    IPCOM000033862D | 2004-Dec-30
  4. 14.
    Disclosed is a method for rigid backbone polymers for a ultra-high temperature (UHT) tray. Benefits include improved functionality, improved performance, and improved reliability.
    IPCOM000033861D | 2004-Dec-30
  5. 15.
    Disclosed is a method for an on-package inductor using chained wirebonds. Benefits include improved functionality, improved performance, and improved ease of implementation.
    IPCOM000033860D | 2004-Dec-30
  6. 16.
    Disclosed is a method for a grid reference plane for on package passive devices. Benefits include improved performance.
    IPCOM000033859D | 2004-Dec-30
  7. 17.
    Disclosed is a method for a wave propagation channel for an interchip wireless interconnect. Benefits include improved performance and improved ease of implementation.
    IPCOM000033858D | 2004-Dec-30
  8. 18.
    Disclosed is a method for a tapered adhesion slot with spikes optimized for high-speed signaling. Benefits include improved functionality and improved performance.
    IPCOM000033857D | 2004-Dec-30
  9. 19.
    Disclosed is a method for a conformal transmission line differential balun on flip-chip ball-grid array (FCBGA) and flip-chip plastic-grid array (FCPGA) packages for narrow-band wireless communication. Benefits include improved performance and improved ease of manufacturing.
    IPCOM000033856D | 2004-Dec-30
  10. 20.
    Disclosed is a method for a silicon packaging substrate restrainer with thermal conducting capabilities. Benefits include improved functionality and improved reliability.
    IPCOM000033855D | 2004-Dec-30