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Month of January 2005 - Page Number 6

Showing 51 - 60 of 4,494 from January 2005
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  1. 51.
    This article relates generally to integrated circuit construction and, more particularly, to transistor gate structure. In submicron CMOS devices, layers of titanium silicide and polysilicon on tungsten silicide gates reduce the gate resistance and the stress on gate oxide. In Fig. 1, silicon substrate 1 has...
    IPCOM000038676D | Original Publication Date: 1987-Feb-01
  2. 52.
    When using robots for assembling parts, such as electronic components, it is necessary that the gripper of the manipulator of the robot be able to grasp parts of different shapes and weights. To this end, it was proposed in the past to use grippers with a plurality of pairs of jaws, with each pair designed to grasp a...
    IPCOM000038675D | Original Publication Date: 1987-Feb-01
  3. 53.
    An offset configuration of a thermal line array (TLA) print head is described which provides: (1) Better print quality with fewer ink transfer variables. (2) Substantial ribbon supply cost savings due to independent displacement of the transfer belt relative to the ribbon. (3) Multiple units with...
    IPCOM000038674D | Original Publication Date: 1987-Feb-01
  4. 54.
    A major cause of failure in writing and reading information using magnetic heads in close proximity to a magnetic recording medium is the presence of magnetic dirt. Magnetic microparticles are readily attracted to the recording head at the gap region which is in closest proximity to the recording medium. This...
    IPCOM000038673D | Original Publication Date: 1987-Feb-01
  5. 55.
    A simplified method has been proposed to prevent latch-up in complementary metal-oxide-semiconductors (CMOS) which integrates a guard ring into the CMOS isolation process of a semi-ROX (recessed oxide) structure. The methodology involves the superimposing of an N+ guard ring around the N-well of the P-channel device....
    IPCOM000038672D | Original Publication Date: 1987-Feb-01
  6. 56.
    This article relates generally to integrated circuit structure and, more particularly, to the fabrication of resistive loads for static random-access memory (SRAM) cells. When load resistors for SRAM cells are constructed in transistor drain junctions, parasitic channels are avoided, resistance can be easily changed...
    IPCOM000038671D | Original Publication Date: 1987-Feb-01
  7. 57.
    Due to differences in thermal expansion between ceramic substrates and epoxy glass cards, if a module with area array pins is soldered to a card, the stress on the solder joints increases as the size of the module increases. The stress on the solder joints can be decreased by bending the pins to provide a foot. The...
    IPCOM000038670D | Original Publication Date: 1987-Feb-01
  8. 58.
    The intensity of each dot of a character display on a CRT (cathode ray tube) screen is controlled so that horizontal and vertical lines are formed to make a uniform character. In character display on a CRT screen, a horizontal line consists of consecutive dots in a row while a vertical line consists of a single dot in...
    IPCOM000038669D | Original Publication Date: 1987-Feb-01
  9. 59.
    Tilt of a rotating disk is an important parameter to know for rotating signal-storing disks. The use of a laser vibrometer (VM), (a machine that generates a voltage n(z) proportional to the velocity of a vibrating surface normal to the laser beam) allows one to measure tangential tilt of the disk during its rotation...
    IPCOM000038668D | Original Publication Date: 1987-Feb-01
  10. 60.
    A surface solder attachment technique is described for attaching electronic modules to circuit cards. Surface solder devices are required to withstand many of the environmental conditions expected of the more traditional leaded (pin- in-hole (PIH)) technologies. One of the more severe conditions, to which assembled...
    IPCOM000038667D | Original Publication Date: 1987-Feb-01