Month of December 2005 - Page Number 2

Showing 11 - 20 of 352 from December 2005
Browse Prior Art Database
  1. 11.
    Disclosed is a method that uses a spring-loaded termination for the land grid array (LGA) socket, instead of the current protruding pins. Benefits include a solution that can withstand improper handling and continuous usage without losing its contact force.
    IPCOM000132643D | 2005-Dec-28
  2. 12.
    Disclosed is a method for a foam-type tungsten/copper thermal interface material. Benefits include improved functionality, improved thermal performance, improved performance, improved reliability, and improved cost effectiveness.
    IPCOM000132642D | 2005-Dec-28
  3. 13.
    Disclosed is a method that controls and manipulates the thermal field residue (in the organic build-up layer) produced by laser irradiation during the drilling process. Benefits include improving the via hole quality and reliability, increasing the efficiency of the laser drilling process.
    IPCOM000132641D | 2005-Dec-28
  4. 14.
    Disclosed is a method that uses an ultra-short pulse laser to drill micro-vias in the iTFC structure. Benefits include minimizing heat induced damages and eliminating the need for wet etching.
    IPCOM000132640D | 2005-Dec-28
  5. 15.
    Disclosed is a method for placing a power supply in package (PSIP) on a multi-layer flex substrate package. Benefits include improved routing densities with flex substrates.
    IPCOM000132639D | 2005-Dec-28
  6. 16.
    Disclosed is a method for gold wire terminals that are wire bonded to either the bond pad or package substrate, enabling multiple wire bond tack points. Benefits include maintaining a small die size and increasing the die stacking flexibility.
    IPCOM000132638D | 2005-Dec-28
  7. 17.
    Disclosed is a method that reduces die level stresses in stacked packages by extending the die attach film over all of the active circuitry on the die
    IPCOM000132637D | 2005-Dec-28
  8. 18.
    Disclosed is a method for multiple JTAG device chain support. Benefits include improved functionality.
    IPCOM000132636D | 2005-Dec-28
  9. 19.
    Disclosed is a method for a substrate-based self-leveling mechanism for a no-flow underfill (NUF) process. Benefits include improved functionality, improved yield, and improved reliability
    IPCOM000132635D | 2005-Dec-28
  10. 20.
    Disclosed is a method for the direct growth of a carbon nanotube (CNT) thermal interface material (TIM). Benefits include improved functionality, improved thermal performance, and improved reliability.
    IPCOM000132634D | 2005-Dec-28