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Month of January 2006 - Page Number 2

Showing 11 - 20 of 395 from January 2006
Browse Prior Art Database
  1. 11.
    Disclosed is a method that uses fractal micro channels embedded in silicon and a micro pump (as a loop-type micro channel heat exchanger) to remove heat from the pump loop. Benefits include cooling multiple components using minimal real state, and more efficient cooling of component hotspots.
    IPCOM000133584D | 2006-Jan-31
  2. 12.
    Disclosed is a method for using polyhedral oligomeric silsesquioxane (POSS) as a filler during die attachment. Benefits include improved functionality and improved performance.
    IPCOM000133583D | 2006-Jan-31
  3. 13.
    Disclosed is a method for the elimination of solder voids while maintaining via-in-pad (VIP) design. Benefits include improved functionality and improved reliability
    IPCOM000133582D | 2006-Jan-31
  4. 14.
    Disclosed is a method for an eight-pin wave soldered heatsink (WSHS). Benefits include improved functionality, improved thermal performance, improved reliability, and improved cost effectiveness.
    IPCOM000133581D | 2006-Jan-31
  5. 15.
    Disclosed is a method for preformed solder mesh. Benefits include improved functionality, improved performance, improved reliability, and improved throughput.
    IPCOM000133580D | 2006-Jan-31
  6. 16.
    Disclosed is a method for a two-stage mold injection process to reduce wire sweeping in stacked-die packages. Benefits include improved functionality and improved performance.
    IPCOM000133579D | 2006-Jan-31
  7. 17.
    Disclosed is a method that uses a MEMS-based testing methodology to examine fatigue and shock properties of metallic materials for microelectronic packaging applications. Benefits include a solution that is more cost-effective than the current state of the art, and is a faster, simpler way to evaluate fundamental...
    IPCOM000133578D | 2006-Jan-31
  8. 18.
    Multimedia SoCs process high resolution images at a high frame rate. In a lot of cases, these systems are limited not by the lack of computational power of the processors, but by lack of bus or memory bandwidth when data are transferred between the image sensor, the main memory and the processing elements of the...
    IPCOM000133577D | Original Publication Date: 2006-Jan-31
  9. 19.
    Disclosed is a method that incorporates a strain gage into the printed wire board (PWB) or substrate through a subtractive or additive photolithographic process. Benefits include providing a non-destructive, more accurate understanding of the strain levels on the solder joint, and allowing better model validation.
    IPCOM000133576D | 2006-Jan-31
  10. 20.
    Disclosed is a method for using negative-coefficient of thermal expansion (CTE) fillers in high-density wire-bonded packages and stacked-die packages. Benefits include improved functionality, improved performance, and improved reliability.
    IPCOM000133575D | 2006-Jan-31