Month of September 2013 - Page Number 5

Showing 41 - 50 of 451 from September 2013
Browse Prior Art Database
  1. 41.
    Disclosed is a method to perform high temperature ultrasonic microscopy without causing damage to organic electronics packages. The method involves heating the electronic components to the associated operating temperature(s) and submerging the part in a hot bath of low acoustic impedance fluid to maintain that...
    IPCOM000231119D | 2013-Sep-27
  2. 42.
    Disclosed is a method for monitoring the substrate resistance by creating a Schottky diode and forward biasing the device.
    IPCOM000231118D | 2013-Sep-27
  3. 43.
    A method and system is disclosed for using per pin power supply data to measure temperature across microprocessors. The method and system uses the by-pin power supplies to measure a resistance between two pins on a supply plane. The resistance is directly related to the temperature of the metal.
    IPCOM000231117D | 2013-Sep-27
  4. 44.
    In the area of electronics packaging that includes flip chip die and organic packages, underfill is typically dispensed under the die during the assembly process. How does one assess underfill position relative to a limit? Known industry practices are used for small quantities of measurements, but these are...
    IPCOM000231116D | 2013-Sep-27
  5. 45.
    Disclosed is a method to increase power savings using a multi-voltage, custom, power grid structure. The method focuses on further improving the current methodology by reducing the voltage on particular cells that are a part of paths with positive slacks and do not belong to a critical path.
    IPCOM000231115D | 2013-Sep-27
  6. 46.
    Disclosed is a method to make it easier to hit wafer test pads. The solution is to place an electrically testable probing target in or adjacent to the pad set.
    IPCOM000231114D | 2013-Sep-27
  7. 47.
    Disclosed is a method to reduce qualification resources and optimize design competitiveness for semiconductor products that use Selective Voltage Binning (SVB).
    IPCOM000231113D | 2013-Sep-27
  8. 48.
    Disclosed is a method to integrate cross talk aware routing into the routing optimization step of the Manufacturing Aware Routing-Routing Based Optimization (MAR-RBO) flow. The method introduces Adaptive Routing in three stages: Adaptive Power Routing, Adaptive Signal Routing, and Adaptive Shielding. The method...
    IPCOM000231112D | 2013-Sep-27
  9. 49.
    Disclosed is an apparatus that enables liquid separation from a Tokyo Electron Ltd. (TEL) developer exhaust. The solution is a liquid separator box that is placed under the TEL developer with an exhaust duct from the tool connecting to the top of the box to capture liquid Tetramethylammonium hydroxide (TMAH). ...
    IPCOM000231111D | 2013-Sep-27
  10. 50.
    Disclosed is a system to facilitate a smarter caller identification feature. The system utilizes rules to search Internet databases, applications, etc. to obtain value-added information about the caller for the user. The system then uses this information to create more information about the caller.
    IPCOM000231110D | 2013-Sep-27