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Month of January 2014 - Page Number 17

Showing 161 - 170 of 427 from January 2014
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  1. 161.
    Disclosed is a method to reduce the cost impact of high power burn-in tooling design changes by segmenting the burn-in board design and hardware into two pieces. The first segment changes along with product changes. The second segment is a universal and reusable board section that allows a portion of the hardware to...
    IPCOM000234581D | 2014-Jan-20
  2. 162.
    Disclosed is a Method to Predict Reliability Throughout the Life of a Product
    IPCOM000234580D | 2014-Jan-20
  3. 163.
    Disclosed is a method to tune the wirebond inductance for thin packages. This method uses a dummy pad next to an active pad to tune wirebond inductance.
    IPCOM000234579D | 2014-Jan-20
  4. 164.
    Disclosed is a method to utilize rules to enhance an Inventory Management System to segregate end-of-life production parts.
    IPCOM000234578D | 2014-Jan-20
  5. 165.
    A method and system is disclosed for providing a real time web based transcription and translation service. The method and system uses machine learning algorithms to provide accurate translation of a conversation of the teleconference.
    IPCOM000234577D | 2014-Jan-20
  6. 166.
    A circuit and method is disclosed for clocking high performance internally double-clocked memory. The circuit and method provides an optimum delay between two internally generated cycles at worst case application while maintaining robust operating margins at fast corners.
    IPCOM000234576D | 2014-Jan-20
  7. 167.
    Previous work (herein referred to as DIS0013) describes a circuit for fitting a contiguous virtual memory space into a physical memory with faults. That circuit relies on a set of Ternary Content Addressable Memory (TCAM) and Static Random Access Memory (SRAM) patterns to perform the actual addressing. A method and...
    IPCOM000234575D | 2014-Jan-20
  8. 168.
    Disclosed is a method to avoid defects that impact chips at the wafer edge and on the wafer caused by the top edge bead region at the wafer edge. The method eliminates the top edge bead removal at Mc/Ca/Via Levels, and adds top edge bead removal to all Aluminum levels that use MUV.
    IPCOM000234574D | 2014-Jan-20
  9. 169.
    Disclosed is a method to make Electromigration (EM) stressing and testing available in line with a consistent temperature profile across the line. The method compensates for the joule heating by using a magnetic field structure to induce the hall effect on the line structure.
    IPCOM000234573D | 2014-Jan-20
  10. 170.
    Alcohol resistant floor coatings are critical to any business or operation where protecting flooring substrates is desired and aesthetic qualities must be maintained.. Solutions containing alcohol can destroy floor coatings rendering them unappealing and exposing the underlying flooring substrate to damage resulting...
    IPCOM000234572D | 2014-Jan-20