Month of January 2018 - Page Number 21

Showing 201 - 210 of 394 from January 2018
Browse Prior Art Database
  1. 201.
    IPCOM000252442D | 2018-Jan-12
  2. 202.
    IPCOM000252441D | 2018-Jan-12
  3. 203.
    IPCOM000252440D | 2018-Jan-12
  4. 204.
    IPCOM000252439D | 2018-Jan-12
  5. 205.
    IPCOM000252438D | 2018-Jan-12
  6. 206.
    A standard BGA array has the potential of the BGA spheres being knocked off during handling prior to being mounted on the board. The corner most BGAs are particularly vulnerable to impact due to the location (isolation) within the array. Current design practice is to depopulate the corner spheres because when in...
    IPCOM000252437D | 2018-Jan-11
  7. 207.
    IPCOM000252436D | 2018-Jan-11
  8. 208.
    IPCOM000252435D | 2018-Jan-11
  9. 209.
    IPCOM000252434D | 2018-Jan-11
  10. 210.
    The developed process uses a thin material layer that enables easy separation of the Glass or Silicon substrate carrier from the Adhesive. This Layer is pre coated onto the Carrier substrate and can be used multiple times for easy Wafer Support System (WSS) de-bonding.
    IPCOM000252433D | 2018-Jan-10